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1

Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints

Borgesen, Peter, Meilunas, Michael

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 986 KB

english, 2011

2

Classifying the Dimensional Variation in Additive Manufactured Parts from Laser-Scanned 3D Point Cloud Data using Machine Learning Approaches

Tootooni, M. Samie, Dsouza, Ashley, Donovan, Ryan, Rao, Prahalad K., Kong, Zhenyu (James), Borgesen, Peter

Journal:

Journal of Manufacturing Science and Engineering

Year:

2017

Language:

english

File:

PDF, 4.76 MB

english, 2017

3

Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions

Zribi, Anis, Borgesen, Peter, Zavalij, Lubov, Cotts, Eric J.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 524 KB

english, 2000

4

Assessing the risk of “Kirkendall voiding” in Cu3Sn

Peter Borgesen, Liang Yin, Pericles Kondos

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.24 MB

english, 2011

5

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Liang Yin, Luke Wentlent, Linlin Yang, Babak Arfaei, Awni Oasaimeh, Peter Borgesen

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.00 MB

english, 2012

6

The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines

David F. Rae, Peter Borgesen, Eric J. Cotts

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2011

Language:

english

File:

PDF, 1.27 MB

english, 2011

7

Acceleration of the growth of Cu3Sn voids in solder joints

Peter Borgesen, Liang Yin, Pericles Kondos

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 857 KB

english, 2012

8

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability and failure mechanism of solder joints in thermal cycling tests

Arfaei, Babak, Mahin-Shirazi, Sam, Joshi, Shantanu, Anselm, Martin, Borgesen, Peter, Cotts, Eric, Wilcox, James, Coyle, Richard

Year:

2013

Language:

english

File:

PDF, 1.78 MB

english, 2013

9

Effects of latent damage of recrystallization on lead free solder joints

Mayyas, Ahmad, Qasaimeh, Awni, Borgesen, Peter, Meilunas, Michael

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 3.36 MB

english, 2014

10

Multiscale modeling of thermoelectric generators for the optimized conversion performance

Zhou, Siyi, Sammakia, Bahgat G, White, Bruce, Borgesen, Peter

Journal:

International Journal of Heat and Mass Transfer

Year:

2013

Language:

english

File:

PDF, 2.88 MB

english, 2013

11

Effects of ‘Latent Damage’ on pad cratering: Reduction in life and a potential change in failure mode

Raghavan, Venkatesh Arasanipalai, Roggeman, Brian, Meilunas, Michael, Borgesen, Peter

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013

12

Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys

Sahaym, Uttara, Talebanpour, Babak, Seekins, Sean, Dutta, Indranath, Kumar, Praveen, Borgesen, Peter

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 4.56 MB

english, 2013

13

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Assessment of PCB pad cratering resistance by joint level testing

Roggeman, Brian, Borgesen, Peter, Li, Jing, Godbole, Guarav, Tumne, Pushkraj, Srihari, K., Levo, Tim, Pitarresi, James

Year:

2008

Language:

english

File:

PDF, 956 KB

english, 2008

14

Multiscale modeling of Thermoelectric Generators for conversion performance enhancement

Zhou, Siyi, Sammakia, Bahgat G., White, Bruce, Borgesen, Peter, Chen, Cheng

Journal:

International Journal of Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 2.36 MB

english, 2015

15

On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Linlin Yang,, Liang Yin,, Arafei, Babak, Roggeman, Brian, Borgesen, Peter

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 2.57 MB

english, 2013

16

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn

Yin, Liang, Kondos, Pericles, Borgesen, Peter, Liu, Yihua, Bliznakov, Stoyan, Wafula, Fred, Dimitrov, Nikolay, Henderson, Donald W., Parks, Christopher, Gao, Mao, Therriault, Joseph, Wang, Ju, Cotts,

Year:

2009

Language:

english

File:

PDF, 1.25 MB

english, 2009

17

Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

Hamasha, Sa’d, Jaradat, Younis, Qasaimeh, Awni, Obaidat, Mazin, Borgesen, Peter

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1013 KB

english, 2014

18

Joint Level Test Methods for Solder Pad Cratering Investigations

Roggeman, Brian D., Raghavan, Venkatesh, Borgesen, Peter

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 2.21 MB

english, 2011

19

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Qasaimeh, Awni, Hamasha, Sa’d, Jaradat, Younis, Borgesen, Peter

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 2.40 MB

english, 2015

20

Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions

Hamasha, Sa'd, Wentlent, Luke, Borgesen, Peter

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.73 MB

english, 2015

21

Assembly issues with Sn/Ag/Cu bumped flip chips

Gopakumar, Sunil, Borgesen, Peter, Srihari, K.

Journal:

Soldering & Surface Mount Technology

Year:

2007

Language:

english

File:

PDF, 438 KB

english, 2007

22

Computational Fluid Dynamics Modeling and Online Monitoring of Aerosol Jet Printing Process

Salary, Roozbeh (Ross), Lombardi, Jack P., Samie Tootooni, M., Donovan, Ryan, Rao, Prahalad K., Borgesen, Peter, Poliks, Mark D.

Journal:

Journal of Manufacturing Science and Engineering

Year:

2016

Language:

english

File:

PDF, 6.27 MB

english, 2016

23

Effects of Strain Rate and Dwell Time on Fatigue Damage Accumulation in Aerosol Jet Printed Nanosilver Traces on Flex

Raj, Arun, Yadav, Manu, Adams, Nardeeka S., Sivasubramony, Rajesh S., Alhendi, Mohammed, Poliks, Mark, Borgesen, Peter

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.16 MB

2020

24

Corrosion inhibition by ion implantation of Al or Mg in Cu, investigated by RBS

Leo G. Svendsen, Peter Børgesen

Journal:

Nuclear Instruments and Methods in Physics Research

Year:

1981

Language:

english

File:

PDF, 339 KB

english, 1981

25

Stopping of keV light ions in solid hydrogen

Peter Børgesen, Hans Sørensen

Journal:

Nuclear Instruments and Methods in Physics Research

Year:

1982

Language:

english

File:

PDF, 799 KB

english, 1982

26

Ranges, reflection and secondary electron emission for keV hydrogen ions incident on solid N2

Peter Børgesen, Hans Sørensen, Chen Hao-Ming

Journal:

Nuclear Instruments and Methods in Physics Research

Year:

1983

Language:

english

File:

PDF, 981 KB

english, 1983

27

Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

Liang Yin, Fred Wafula, Nikolay Dimitrov, Peter Borgesen

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 699 KB

english, 2012

28

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A multiscale modeling of Thermoelectric Generators for conversion efficiency optimization

Siyi Zhou,, Sammakia, Bahgat G., White, Bruce, Borgesen, Peter

Year:

2012

Language:

english

File:

PDF, 875 KB

english, 2012

29

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - On the nature of pad cratering

Godbole, Gaurav, Roggeman, Brian, Borgesen, Peter, Srihari, Krishnaswamy

Year:

2009

Language:

english

File:

PDF, 1.51 MB

english, 2009

30

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of microstructure evolution on damage accumulation in lead-free solder joints

Yang, Linlin, Yin, Liang, Roggeman, Brian, Borgesen, Peter

Year:

2010

Language:

english

File:

PDF, 2.25 MB

english, 2010

31

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion

Venkatadri, Vikram, Yin, Liang, Xing, Yan, Cotts, Eric, Srihari, K., Borgesen, Peter

Year:

2009

Language:

english

File:

PDF, 1.41 MB

english, 2009

32

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of pre-stressing on solder joint failure by pad cratering

Raghavan, Venkatesh, Roggeman, Brian, Meilunas, Michael, Borgesen, Peter

Year:

2010

Language:

english

File:

PDF, 1.83 MB

english, 2010

33

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue

Yin, Liang, Meilunas, Michael, Arfaei, Babak, Wentlent, Luke, Borgesen, Peter

Year:

2012

Language:

english

File:

PDF, 967 KB

english, 2012

34

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Assessment of microelectronics interconnect reliability - current practice and trends

Borgesen, Peter

Year:

2014

Language:

english

File:

PDF, 85 KB

english, 2014

35

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!

Borgesen, Peter, Yin, Liang, Kondos, Pericles, Henderson, Donald W., Servis, Greg, Therriault, Joseph, Wang, Ju, Srihari, K.

Year:

2007

Language:

english

File:

PDF, 4.74 MB

english, 2007

36

On the root cause of Kirkendall voiding in Cu3Sn

Yin, Liang, Borgesen, Peter

Journal:

Journal of Materials Research

Year:

2011

Language:

english

File:

PDF, 593 KB

english, 2011

37

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Crack evolution and rapid life assessment for lead free solder joints

Qasaimeh, Awni, Lu, Susan, Borgesen, Peter

Year:

2011

Language:

english

File:

PDF, 1.11 MB

english, 2011

38

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Recrystallization behavior of lead free and lead containing solder in cycling

Qasaimeh, Awni, Jaradat, Younis, Wentlent, Luke, Yang, Linlin, Yin, Liang, Arfaei, Babak, Borgesen, Peter

Year:

2011

Language:

english

File:

PDF, 1.68 MB

english, 2011

39

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging

Jaradat, Younis, Qasaimeh, Awni, Kondos, Pericles, Arfaei, Babak, Borgesen, Peter

Year:

2011

Language:

english

File:

PDF, 3.37 MB

english, 2011

40

Pb-Free Solder: New Materials Considerations for Microelectronics Processing

Borgesen, Peter, Bieler, Thomas, Lehman, L. P., Cotts, E. J.

Journal:

Year:

2007

Language:

english

File:

PDF, 605 KB

english, 2007

41

Hybrid Inorganic/Organic Self-Assembled Clays Nanocomposites for Roll to Roll Fabrication in Photovoltaics

Kariuki, Peter Njagwa, Gendron, Jessica, Madl, Christopher Matthew, Chiguma, Jasper, Hagerman, Michael E, Borgesen, Peter, Jones, Wayne E

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 3.03 MB

english, 2009

42

[ECS 215th ECS Meeting - San Francisco, CA (May 24 - May 29, 2009)] ECS Transactions - Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper

Wafula, Fred, Liu, Yihua, Yin, Liang, Bliznakov, Stoyan, Borgesen, Peter, Cotts, Eric, Dimitrov, Nikolay

Year:

2009

Language:

english

File:

PDF, 1.60 MB

english, 2009

43

Treatment of hydrocephalus determined by the European Orbis Sigma Valve II survey: a multicenter prospective 5-year shunt survival study in children and adults in whom a flow-regulating shunt was used

Hanlo, Patrick W., Cinalli, Giuseppe, Vandertop, W. Peter, Faber, Joop A. J., Bøgeskov, Lars, Børgesen, Svend E., Boschert, Jürgen, Chumas, Paul, Eder, Hans, Pople, Ian K., Serlo, Willy, Vitzthum, Eck

Journal:

Journal of Neurosurgery

Year:

2003

Language:

english

File:

PDF, 63 KB

english, 2003

44

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Hamasha, Sa'd, Qasaimeh, Awni, Jaradat, Younis, Borgesen, Peter

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.50 MB

english, 2015

45

[ASME ASME 2012 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 9 November 2012)] Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B - Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

D’Angelo, Dustin, Ramkumar, S. Manian, Wentlent, Luke, Borgesen, Peter

Year:

2012

Language:

english

File:

PDF, 1.22 MB

english, 2012

46

[ASME ASME 2005 International Mechanical Engineering Congress and Exposition - Orlando, Florida, USA (November 5 – 11, 2005)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - A Study on Optical Fiber Damage Due to Optoelectronic Assembly Processes

Nagarkar, Kaustubh R., Borgesen, Peter, Srihari, Krishnaswami

Year:

2005

Language:

english

File:

PDF, 284 KB

english, 2005

47

Mechanical Properties of CVD Tungsten Fibers

Lilienfeld, David, Steinwall, James, Borgesen, Peter

Journal:

MRS Proceedings

Year:

1990

Language:

english

File:

PDF, 1.86 MB

english, 1990

48

Area Array Solder Joints for Passive Alignment

McGroarty, John, Yost, Boris, Børgesen, Peter, Li, Che-Yu

Journal:

MRS Proceedings

Year:

1992

Language:

english

File:

PDF, 458 KB

english, 1992

49

A Damage Integral Based Analysis and Simulation of the Thermal Fatigue of Diebonds

Lilienfeld, David A., Børgesen, Peter, Li, Che-Yu

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 354 KB

english, 1993

50

SPIE Proceedings [SPIE Microelectronic Processing '92 - San Jose, CA (Sunday 20 September 1992)] Submicrometer Metallization: Challenges, Opportunities, and Limitations - Statistical distributions of stress and electromigration-induced failure

Borgesen, Peter, Korhonen, M. A., Li, Che-Yu, Kwok, Thomas, Kikkawa, Takamaro, Shenai, Krishna

Year:

1993

Language:

english

File:

PDF, 948 KB

english, 1993

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